发明名称 |
COMPOSITION FOR SILICON WAFER POLISHING |
摘要 |
This invention provides a silicon wafer polishing composition used in the presence of an abrasive. The composition comprises a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-containing polymer has a building unit A in its main chain. The building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group. The carbonyl carbon atom constituting the secondary amide group or tertiary amide group is directly coupled to the main chain carbon atom. |
申请公布号 |
EP3007213(A1) |
申请公布日期 |
2016.04.13 |
申请号 |
EP20140807048 |
申请日期 |
2014.05.02 |
申请人 |
FUJIMI INCORPORATED |
发明人 |
TSUCHIYA, KOHSUKE;TANSHO, HISANORI;ICHITSUBO, TAIKI;MORI, YOSHIO |
分类号 |
H01L21/02;B24B37/04;C09G1/02;C09K3/14 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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