| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package having high airtightness and a method for manufacturing the same.SOLUTION: This electronic component package includes: a first substrate; a second substrate disposed so as to be opposite to the first substrate; an electronic component mounted on the first substrate side of the second substrate; an adhesive formed so as to surround the outside of the electronic component between respective facing surfaces of the first substrate and the second substrate; and a first metal film covering the inside surface of the adhesive. The electronic component is sealed by the respective facing surfaces of the first substrate and the second substrate, and the first metal film. |
