发明名称 |
INSULATING THERMALLY CONDUCTIVE RESIN COMPOSITION |
摘要 |
An insulating thermally conductive resin composition (1) includes a phase-separated structure including: a first resin phase (2) in which a first resin continues three-dimensionally; and a second resin phase (3) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler (4) unevenly distributed in the first resin phase; and large-diameter inorganic filler (5) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 µm. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 µm. |
申请公布号 |
EP2980161(A4) |
申请公布日期 |
2016.04.13 |
申请号 |
EP20140772690 |
申请日期 |
2014.03.03 |
申请人 |
PANASONIC CORPORATION |
发明人 |
KOTANI, YUKI;YODEN, HIROYOSHI;KISHI, HAJIME;SARUWATARI, TAKASHI |
分类号 |
C08L101/12;C08K3/22;C08K3/38;C08L63/00;C08L81/06;H01B3/00;H01B3/40 |
主分类号 |
C08L101/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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