| 摘要 |
The invention relates to a method for contacting a semiconductor substrate by means of an ink-jet printing method, comprising the following method steps: providing a contacting agent in a low-viscosity initial state, driving the low-viscosity contacting agent through an ink-jet nozzle arrangement, exposing the contacting agent to an energy input and/or a chemical reactant in order to convert the contacting agent to a higher-viscosity final state immediately after the contacting agent passes through the nozzle arrangement and/or when the contacting agent hits the semiconductor substrate. The invention further relates to a device for contacting a semiconductor substrate by means of an ink-jet printing method, containing a reservoir having a low-viscosity contacting agent, an ink-jet nozzle arrangement, and an energy-applying unit directed at a jet area of the ink-jet nozzle arrangement and/or at a point of incidence of the contacting agent. |
