| 发明名称 | Load spreading interposer | ||
| 摘要 | A package for active electronics is provided. The package includes a housing structure configured to house the active electronics, a connector element and an interposer element disposed to define a tie point between the housing structure and the connector element such that the tie point is remote from respective edges of the housing structure and the connector element. | ||
| 申请公布号 | US9312607(B2) | 申请公布日期 | 2016.04.12 |
| 申请号 | US201313765013 | 申请日期 | 2013.02.12 |
| 申请人 | RAYTHEON COMPANY | 发明人 | Wolf Steven R. |
| 分类号 | H05K5/02;H01Q21/00;H01R12/71;H05K7/10 | 主分类号 | H05K5/02 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP |
| 主权项 | 1. A package for active electronics, comprising: a housing structure configured to house the active electronics; a connector element; and an interposer element adhered to the housing structure by epoxy, mechanically fastened to the connector element and disposed to define a tie point between the housing structure and the connector element such that the tie point is remote from respective edges of the housing structure and the connector element. | ||
| 地址 | Waltham MA US | ||