发明名称 Microbattery and method for manufacturing a microbattery
摘要 A microbattery that includes, in succession starting from a first substrate: a first current collector, a first electrode, an electrolyte, a second electrode consisting of a solder joint, a second current collector and a second substrate. Additionally, a method for manufacturing a microbattery, which includes the following steps: forming a thin-film multilayer including, in succession from the first substrate, a first current collector, a first electrode, an electrolyte and a first metal film; forming a second current collector on a face of a second substrate; and forming a second electrode by soldering the first metal film and the second current collector together, said substrates being placed facing each other during assembly.
申请公布号 US9312561(B2) 申请公布日期 2016.04.12
申请号 US201113806004 申请日期 2011.05.31
申请人 COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES 发明人 Oukassi Sami;Dunoyer Nicolas;Salot Raphael
分类号 H01M10/04;H01M4/58;H01M4/66;H01M6/40;H01M10/052;H01M10/0585;H01M4/04;H01M4/38;H01M4/485;H01M4/505;H01M4/525;H01M10/0562 主分类号 H01M10/04
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A method for manufacturing a microbattery comprising the following steps of: forming a stack of thin films on a first substrate comprising, successively, starting from the first substrate, a first current collector, a first electrode, an electrolyte, and a first metal film, forming a second current collector on a face of a second substrate, and forming a second electrode, said step of forming the second electrode comprising an assembly step of said first and second substrates by soldering the first metal film and the second current collector together using a solder ball previously deposited on a contact face of the first metal film or on a contact face of the second current collector, said first and second substrates being placed facing each other during the assembly step, so as to obtain the second electrode formed by a solder joint comprising at least one intermetallic compound resulting from an interdiffusion of a metallic species of the solder ball and of the first metal film.
地址 Paris FR