发明名称 Adhesive height setting
摘要 Methods for adhering parts together using part gap spacers are provided herein. Part gap spacers are formed in a selected pattern and a selected height on a surface of at least one surface of two parts to be oppositely disposed. When disposed opposite each other, at least some of the part gap spacers contact the opposite surface, and establish a standoff distance that is generally uniform, and thereby creating voids. Adhesive is disposed in at least some of the voids to adhere the part surfaces to each other. Further methods comprise forming part gap spacers on multiple sides of a third part to be disposed intermediate two surfaces. The part gap spacers can be formed in a variety of shapes, including bumps, tapers, ribs, and flange edges.
申请公布号 US9311955(B2) 申请公布日期 2016.04.12
申请号 US201414146408 申请日期 2014.01.02
申请人 Seagate Technology LLC 发明人 Flores Paco;Aiello Anthony J.;Kloeppel Klaus D.;Berry Reid E.
分类号 B29C65/00;B32B37/00;F16C32/06;H02K5/16;H02K7/08;G11B17/02;B21K1/10;G11B19/20;B29C65/48 主分类号 B29C65/00
代理机构 代理人
主权项 1. An apparatus comprising: a first part, wherein the first part is cup shaped,the first part includes a plurality of spacing elements protruding from a first surface of the first part,a height of the plurality of spacing elements provides a stand-off distance less than or equal to about 150 microns, andthe first part includes a plurality of bumps protruding from a second surface of the first part, wherein the second surface is substantially parallel to the first surface; a second part on at least some of the plurality of spacing elements, wherein the second part and the plurality of spacing elements define a plurality of voids; an adhesive in at least some of the plurality of voids, wherein the adhesive adheres the first part to the second part; and a third part on at least some of the plurality of bumps, wherein the plurality of bumps provide a substantially uniform stand-off distance between the first part and the third part.
地址 Cupertino CA US