发明名称 |
Extreme ultraviolet light (EUV) photomasks, and fabrication methods thereof |
摘要 |
Embodiments of EUV photomasks and methods for forming a EUV photomask are provided. The method comprises providing a substrate, a reflective layer, a capping layer, a hard mask layer, and forming an opening therein. An absorber layer is then filled in the opening and over the top surface of the hard mask layer. A planarized process is provided to remove the absorber layer above the top surface of the hard mask layer and form an absorber in the opening, wherein the absorber has a top portion wider than a bottom portion. |
申请公布号 |
US9310675(B2) |
申请公布日期 |
2016.04.12 |
申请号 |
US201313950020 |
申请日期 |
2013.07.24 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Tao-Min;Shih Chih-Tsung;Chen Chia-Jen;Lee Hsin-Chang;Yen Anthony |
分类号 |
G03F1/22;G03F1/24;G03F1/80;G03F1/72 |
主分类号 |
G03F1/22 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A method of fabricating an extreme ultraviolet photomask, comprising:
providing a mask comprising, in order, a substrate, a reflective layer, and a capping layer; forming an opening having a first portion in the capping layer and a second portion within at least a portion of the reflective layer, wherein the first portion has a width greater than a width of the second portion; forming an absorber layer in the opening and over a top surface of the capping layer; and removing at least a portion of the absorber layer, while leaving another portion of the absorber layer to form an absorber. |
地址 |
Hsin-Chu TW |