发明名称 Extreme ultraviolet light (EUV) photomasks, and fabrication methods thereof
摘要 Embodiments of EUV photomasks and methods for forming a EUV photomask are provided. The method comprises providing a substrate, a reflective layer, a capping layer, a hard mask layer, and forming an opening therein. An absorber layer is then filled in the opening and over the top surface of the hard mask layer. A planarized process is provided to remove the absorber layer above the top surface of the hard mask layer and form an absorber in the opening, wherein the absorber has a top portion wider than a bottom portion.
申请公布号 US9310675(B2) 申请公布日期 2016.04.12
申请号 US201313950020 申请日期 2013.07.24
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Huang Tao-Min;Shih Chih-Tsung;Chen Chia-Jen;Lee Hsin-Chang;Yen Anthony
分类号 G03F1/22;G03F1/24;G03F1/80;G03F1/72 主分类号 G03F1/22
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A method of fabricating an extreme ultraviolet photomask, comprising: providing a mask comprising, in order, a substrate, a reflective layer, and a capping layer; forming an opening having a first portion in the capping layer and a second portion within at least a portion of the reflective layer, wherein the first portion has a width greater than a width of the second portion; forming an absorber layer in the opening and over a top surface of the capping layer; and removing at least a portion of the absorber layer, while leaving another portion of the absorber layer to form an absorber.
地址 Hsin-Chu TW