Substrate processing apparatus, substrate processing method and storage medium

摘要

Provided is a substrate processing apparatus including a substrate holding unit configured to hold a wafer W horizontally, a rotation driving unit configured to rotate the substrate holding unit, a first chemical liquid nozzle configured to discharge a first chemical liquid to a first chemical liquid supplying position on the peripheral portion of the wafer W, and a second chemical liquid nozzle configured to discharge a second chemical liquid to a second chemical liquid supplying position on the peripheral portion of the wafer W. The rotation driving unit rotates the substrate holding unit in a first rotation direction when the first chemical liquid nozzle discharges the first chemical liquid, and rotates the substrate holding unit in a second rotation direction when the second chemical liquid nozzle discharges the second chemical liquid.

主权项

1. A substrate processing apparatus comprising:
a substrate holding unit configured to hold a substrate in a horizontal direction to perform a liquid processing for a peripheral portion of the substrate by a chemical liquid; a rotation driving unit configured to rotate the substrate holding unit to perform the liquid processing while rotating the substrate held by the substrate holding unit in a horizontal direction; a first chemical liquid nozzle configured to discharge a first chemical liquid to a first chemical liquid supplying position on the peripheral portion of the substrate; a second chemical liquid nozzle configured to discharge a second chemical liquid different from the first chemical liquid to a second chemical liquid supplying position on the peripheral portion of the substrate; a first chemical liquid supplying unit connected to the first chemical liquid nozzle and configured to supply the first chemical liquid to the first chemical liquid nozzle; and a second chemical liquid supplying unit connected to the second chemical liquid nozzle and configured to supply the second chemical liquid to the second chemical liquid nozzle, wherein the substrate processing apparatus further comprises a control unit configured to control: the first chemical liquid nozzle to discharge the first chemical liquid while rotating the substrate holding unit in the first rotation direction, and the second chemical liquid nozzle to discharge the second chemical liquid while rotating the substrate holding unit in the second rotation direction, and wherein the rotation driving unit rotates the substrate holding unit in a first rotation direction when the first chemical liquid nozzle discharges the first chemical liquid, and rotates the substrate holding unit in a second rotation direction, which is opposite to the first rotation direction, when the second chemical liquid nozzle discharges the second chemical liquid, the first chemical liquid nozzle is configured such that a discharging direction of the first chemical liquid to be discharged is inclined into the first rotation direction, and the second chemical liquid nozzle is configured such that a discharging direction of the second chemical liquid to be discharged is inclined into the second rotation direction.