METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a semiconductor device includes the processes of preparing an adhesion member and a semiconductor wafer stuck on an adhesion surface of the adhesion member, and preparing a structure where a circuit formed surface of the semiconductor water is stuck on the adhesion surface of the adhesion member; forming a plurality of flued openings having a predetermined width on a surface opposite to the circuit formed surface of the semiconductor wafer along a dicing region of the semiconductor wafer in a state that the adhesion member is stuck on the circuit formed surface of the semiconductor; allowing a semiconductor encapsulating resin composition in a flowing state to be in contact with the semiconductor wafer to fill the semiconductor encapsulating resin composition in the flued openings, and covering the surface opposite to the circuit formed surface of the semiconductor wafer with the semiconductor encapsulating resin composition; and hardening the semiconductor encapsulating resin composition.