发明名称 Three-D power converter in three distinct strata
摘要 A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.
申请公布号 US9312761(B2) 申请公布日期 2016.04.12
申请号 US201414178791 申请日期 2014.02.12
申请人 International Business Machines Corporation 发明人 Andry Paul S.;Chang Leland;Colgan Evan G.;Knickerbocker John U.;Webb Bucknell C.;Wisnieff Robert
分类号 H03K3/00;H02M3/156;H02M1/08;G06F1/26;H05K1/00 主分类号 H03K3/00
代理机构 Scully, Scott, Murphy & Presser, P.C. 代理人 Scully, Scott, Murphy & Presser, P.C. ;Percello, Esq. Louis J.
主权项 1. A three-dimensional switching power supply in an integrated circuit stack comprising a device layer, the switching power supply comprising: three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors; and a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer; wherein the switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.
地址 Armonk NY US