发明名称 Semiconductor device
摘要 A method for bypassing a defective through silicon via x in a group of n adjacent through silicon vias, includes receiving a plurality of relief signals to identify the defective through silicon via x, activating x−1 switch circuits to connect x−1 data circuits to through silicon vias 1 to x−1 in the group of n adjacent through silicon vias, activating n−x switch circuits to connect n−x data circuits to through silicon vias x+1 to n in the group of n adjacent through silicon vias, and activating a switch circuit to connect a data circuit to an auxiliary through silicon via which is adjacent through silicon via n in the group of n adjacent through silicon vias.
申请公布号 US9312209(B2) 申请公布日期 2016.04.12
申请号 US201514634510 申请日期 2015.02.27
申请人 PS4 LUXCO S.A.R.L. 发明人 Shibata Kayoko;Miwa Hitoshi;Inoue Yoshihiko
分类号 G06F9/455;G06F17/50;H01L23/48;G11C5/06;G11C29/02;G11C29/12;H01L25/065;H01L27/108;H01L23/538;H01L27/105;H01L21/66 主分类号 G06F9/455
代理机构 Kunzler Law Group 代理人 Kunzler Law Group
主权项 1. A semiconductor device comprising: a plurality of n data circuits; a plurality of n adjacent through silicon vias; an auxiliary through silicon via; a relief information circuit configured to provide a plurality of relief signals to identify a defective through silicon via x in the plurality of n through silicon vias, wherein x is an integer greater than 1 and n is an integer greater than x; and a plurality of n switch circuits, the plurality of n switch circuits being configured so that x−1 switch circuits of the n switch circuits are activated based on the relief signals to connect x−1 data circuits to through silicon vias 1 to x−1 in the plurality of n adjacent through silicon vias, n−x switch circuits of the n switch circuits are activated based on the relief signals to connect n−x data circuits to through silicon vias x+1 to n in the plurality of n adjacent through silicon vias, and a switch circuit of the n switch circuits is activated based on the relief signals to connect a data circuit to the auxiliary through silicon via; wherein each of the n switch circuits is configured to receive a data signal from a corresponding one of the n data circuits and to output the data signal to one of two through silicon vias of the n adjacent through silicon vias and the auxiliary through silicon via depending on the relief signals.
地址 Luxembourg LU