| 发明名称 | Solder, solder joint structure and method of forming solder joint structure | ||
| 摘要 | A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material. | ||
| 申请公布号 | US9308603(B2) | 申请公布日期 | 2016.04.12 |
| 申请号 | US201313855719 | 申请日期 | 2013.04.03 |
| 申请人 | Industrial Technology Research Institute | 发明人 | Kao Kuo-Shu;Chang Tao-Chih;Chen Wen-Chih |
| 分类号 | B32B15/20;B23K35/24;B32B15/01;B23K35/28;B23K35/30;H01L23/495;H01L23/00;H01L23/373;H01L25/065 | 主分类号 | B32B15/20 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A solder joint structure, comprising: a zinc-based material, having a surface, wherein the zinc-based material comprises copper; and an intermetallic layer, consisting of an alloy of zinc and noble metal, wherein the noble metal comprises gold, silver, or palladium, and the intemetallic layer completely covers the surface of the zinc-based material. | ||
| 地址 | Hsinchu TW | ||