Apparatus for void-free debulking of adhesive bonded joints

摘要

Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

主权项

1. An apparatus for use in forming a bonded joint, comprising:
a strongback support tool; a spacer that is connected to one side of said strongback support tool and projects away from said strongback support tool, said spacer extending completely around a space adjacent to said one side of said strongback support tool; an expandable apparatus comprising first and second members pivotably coupled to said strongback support tool, and third and fourth members respectively pivotably coupled to said first and second members, said expandable apparatus being disposed within said space when in a retracted state and when in an expanded state; and a tooling pressure plate pivotably coupled to said third and fourth members, wherein said tooling pressure plate displaces away from said strongback support tool when said expandable apparatus changes state from said retracted state to said expanded state.