Attenuation reduction structure for high frequency signal contact pads of circuit board

摘要

An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.

主权项

1. An attenuation reduction structure for a circuit board having a wiring mounting surface and a grounding line mounting surface, a contact pad mounting section being defined on the wiring mounting surface of the circuit board, comprising:
a plurality of high frequency signal contact pads formed on the contact pad mounting section to be adjacent to and insulatively isolated from each other; at least one high frequency signal line formed on the wiring mounting surface of the circuit board and electrically connected to the high frequency signal contact pads; and a grounding layer, which is formed on the grounding line mounting surface of the circuit board, the grounding layer and the high frequency signal lines having a reference thickness therebetween; wherein the circuit board has an expanded thickness between the high frequency signal contact pads and the grounding layer and the expanded thickness is greater than the reference thickness.