Cooling heat-generating electronics

摘要

A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

主权项

1. A server rack sub-assembly, comprising:
at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard that is substantially thermally decoupled from the motherboard perimeter; an airflow pathway thermally separated from the area of the motherboard that is substantially thermally decoupled from the motherboard perimeter, that is defined along opposed sides of the perimeter of the motherboard from a first edge of the motherboard to a second edge of the motherboard; one or more brackets comprising heat transfer surfaces and attached to the motherboard within the airflow pathways, the one or more brackets adapted to couple the motherboard to a server rack assembly, the one or more brackets positioned in the airflow pathway to receive a cooling airflow that is circulated within the server rack sub-assembly over the one or more brackets without circulating over the area of the motherboard that is substantially thermally decoupled from the motherboard perimeter; and a heat transfer device thermally arranged to conductively transfer heat from the one or more electronic devices to the brackets, at least a portion of the heat transfer device including the one or more brackets.