Method for manufacturing a double-sided printed circuit board

摘要

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.

主权项

1. A method for manufacturing a double-sided flexible printed circuit board, the method comprising the steps of:
(A) preparing a single-sided copper clad laminate or forming a copper layer on a single side of a flexible base substrate to manufacture the single-sided copper clad laminate; (B) forming via-holes in the flexible base substrate through the single-sided copper clad laminate; (C) printing a conductive paste on the other side of the copper foil of the single-sided copper clad laminate to form a plated bottom layer on the via-hole simultaneously with forming a circuit pattern; (D) plating a copper clad surface of the single-sided copper clad laminate, the via-hole including the plated bottom layer formed thereon, and the circuit pattern formed by printing the conductive paste; (E) forming a coverlay layer on the conductive paste-printed surface; and (F) etching the copper clad surface of the copper clad laminate to form a circuit.