| 摘要 |
The present invention relates to a light emitting diode package for side-view, and more particularly, to a light emitting diode package for side-view, capable of preventing reliability from being degraded when the light emitting diode package is produced thinly. The light emitting diode package for side-view according to an embodiment of the present invention includes: a package body having a front surface with a cavity accommodating a light emitting diode chip, a rear surface on an opposite side of the front surface, and first and second side surfaces connecting the front surface and the rear surface; and a first lead and a second lead disposed in the package body, and electrically connected to the light emitting diode chip in the cavity, wherein the first lead and the second lead are extended and exposed to the outside through the first side surface. According to present invention, the first lead and the second lead are partially extended and exposed from the inside of the package body to the outside, thereby having an effect on reducing the thickness of the light emitting diode package for side-view. Moreover, the package body is made of thermosetting resins such as epoxy molding compound (EMC) or white silicone, so that a heat resistance property of the package body is improved. |
