发明名称 |
Conductive pillar structure for semiconductor substrate and method of manufacture |
摘要 |
A conductive pillar structure for a die includes a passivation layer having a metal contact opening over a substrate. A bond pad has a first portion inside the metal contact opening and a second portion overlying the passivation layer. The second portion of the bond pad has a first width. A buffer layer over the bond pad has a pillar contact opening with a second width to expose a portion of the bond pad. A conductive pillar has a first portion inside the pillar contact opening and a second portion over the buffer layer. The second portion of the conductive pillar has a third width. A ratio of the second width to the first width is between about 0.35 and about 0.65. A ratio of the second width to the third width is between about 0.35 and about 0.65. |
申请公布号 |
US9312230(B2) |
申请公布日期 |
2016.04.12 |
申请号 |
US201012701868 |
申请日期 |
2010.02.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Chen Chih-Hua;Chen Chen-Shien;Kuo Chen-Cheng |
分类号 |
H01L23/00;H01L23/31 |
主分类号 |
H01L23/00 |
代理机构 |
Hauptman Ham, LLP |
代理人 |
Hauptman Ham, LLP |
主权项 |
1. A semiconductor die comprising:
a substrate; a passivation layer having a metal contact opening over the substrate; a bond pad having a first portion inside the metal contact opening and a second portion overlying the passivation layer, the second portion of the bond pad having a first width; a buffer layer disposed over the bond pad, the buffer layer having a pillar contact opening with a second width to expose a portion of the bond pad; and a conductive pillar having a first portion inside the pillar contact opening and a second portion disposed over the buffer layer, the second portion of the conductive pillar having a third width, wherein a ratio of the second width to the first width is between about 0.35 and about 0.65, and a second ratio of the second width to the third width is between about 0.35 and about 0.65. |
地址 |
TW |