发明名称 |
Electronic system with heat extraction and method of manufacture thereof |
摘要 |
An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism. |
申请公布号 |
US9313874(B2) |
申请公布日期 |
2016.04.12 |
申请号 |
US201313922105 |
申请日期 |
2013.06.19 |
申请人 |
SMART STORAGE SYSTEMS, INC. |
发明人 |
Dean David Lee;Ellis Robert W. |
分类号 |
H05K7/20;H05K1/02;H05K3/30;H01L23/367;H01L21/48;H01L23/473 |
主分类号 |
H05K7/20 |
代理机构 |
Morgan, Lewis & Bockius LLP |
代理人 |
Morgan, Lewis & Bockius LLP |
主权项 |
1. An electronic system comprising:
a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape formed using an extrusion mechanism, and the extruded shape including a base portion and a V-beam shape extending from the base portion, the V-beam shape including a first non-horizontal portion and a second non-horizontal portion, the base portion attached to the substrate, the first non-horizontal portion and the second non-horizontal portion extending outwardly from the base portion with the first non-horizontal portion and the second non-horizontal portion formed at an angle less than 90 degrees from the base portion. |
地址 |
Chandler AZ US |