发明名称 Aluminum-based alloy conductive wire used in semiconductor package and manufacturing method thereof
摘要 An aluminum-based alloy conductive wire used in semiconductor package is composed of 0.05 to 0.14 weight percent scandium (Sc), 0.01 to 0.1 weight percent zirconium (Zr), 0.01 to 0.1 weight percent silicon (Si) and the balance aluminum (Al), wherein the aluminum-based alloy conductive wire is made from high purity aluminum, aluminum-scandium alloy, aluminum-zirconium alloy and aluminum-silicon alloy by a melting treatment, a casting treatment, a solution treatment, a plastic processing and an aging treatment.
申请公布号 US9312235(B1) 申请公布日期 2016.04.12
申请号 US201414573150 申请日期 2014.12.17
申请人 METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE 发明人 Kang Ching-Shing;Yeh Sung-Wei;Shih Chin-Hsiang
分类号 C22C21/00;H01L23/00;C22F1/04 主分类号 C22C21/00
代理机构 Jackson IPG PLLC 代理人 Jackson IPG PLLC ;Jackson Demian K.
主权项 1. An aluminum-based alloy conductive wire used in semiconductor package consisting of 0.05 to 0.14 weight percent scandium (Sc), 0.01 to 0.1 weight percent zirconium (Zr), 0.01 to 0.1 weight percent silicon (Si) and the balance aluminum (Al).
地址 Kaohsiung TW