发明名称 Power electronics system with liquid cooling system
摘要 A power electronics system includes a multipart housing having three housing elements of cuboid basic structure to define a central element with inlet and outlet ports for a cooling liquid, an upper and lower cover elements which are arranged on opposite connection surfaces of the central element. A plurality of power electronics switching devices is accommodated in the housing, and a condenser device having condenser connection elements is arranged in the central element of the housing> Further provided is a liquid cooling system having at least one first upper cooling chamber between the central element and the upper cover element, and at least two first and second lower cooling chambers between the central element and the lower cover element. The upper and lower cooling chambers are configured for circulation of the cooling liquid entering through the inlet port and exiting through the outlet port of the housing.
申请公布号 US9313922(B2) 申请公布日期 2016.04.12
申请号 US201314019074 申请日期 2013.09.05
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 Müller Alex;Trodler Dirk
分类号 H05K7/20 主分类号 H05K7/20
代理机构 Henry M. Feiereisen LLC 代理人 Henry M. Feiereisen LLC
主权项 1. A power electronics system, comprising: a multipart housing having three housing elements of cuboid basic structure to define a central element having an inlet port and an outlet port for a cooling liquid, an upper cover element, and a lower cover element, said upper and lower cover elements arranged on opposite connection surfaces of the central element; a plurality of power electronics switching devices accommodated in the housing; a condenser device having condenser connection elements arranged in the central element of the housing; and a liquid cooling system having a plurality of cooling chambers located between all three elements and including at least one first upper cooling chamber between the central element and the upper cover element, and at least two first and second lower cooling chambers between the central element and the lower cover element, said upper and lower cooling chambers configured for circulation of the cooling liquid entering through the inlet port and exiting through the outlet port of the housing.
地址 München DE