Mounting structure and mounting method

摘要

A mounting structure includes a first ceramic electronic component including a ceramic body including internal electrodes and outer electrodes. When a voltage is applied to the outer electrodes, the ceramic body is strained with a first strain amount, and a second ceramic electronic component including a ceramic body including internal electrodes and outer electrodes. When a voltage is applied to the outer electrodes, the ceramic body is strained with a second strain amount greater than the first strain amount. The second ceramic electronic component is arranged above the first ceramic electronic component, and the first and second ceramic electronic components are connected to each other via each other's outer electrodes. The first ceramic electronic component to which the second ceramic electronic component is connected is connected to a land on a circuit substrate via the outer electrodes of at least the first ceramic electronic component.

主权项

1. A mounting structure comprising:
a first ceramic electronic component including a first ceramic body including a first internal electrode and a first outer electrode, wherein when a voltage is applied to the first outer electrode, the first ceramic body is strained with a first strain amount; and a second ceramic electronic component including a second ceramic body including a second internal electrode and a second outer electrode, wherein when a voltage is applied to the second outer electrode, the second ceramic body is strained with a second strain amount greater than the first strain amount; wherein the second ceramic electronic component is arranged above the first ceramic electronic component, and the first and second ceramic electronic components are connected to each other via the first and second outer electrodes; the first ceramic electronic component to which the second ceramic electronic component is connected is connected to a land on a circuit substrate via at least the first outer electrode of the first ceramic electronic component; where tB denotes a first height of a first central portion of the first ceramic body measured from the circuit substrate, SB denotes the first strain amount of the first central portion, tA denotes a second height of a second central portion of the second ceramic body measured from the circuit substrate, and SA denotes the second strain amount of the second central portion, a distance tD from the second central portion of the second ceramic body to a fixed point on the circuit substrate measured in a direction toward the circuit substrate is equal to SA(tA−tB)/(SA−SB).