| 发明名称 |
Chip, chip arrangement and method for producing a chip |
| 摘要 |
Various embodiments provide a chip. The chip has a carrier, an integrated circuit formed above the carrier, and an energy storage element. The energy storage element has a first electrode and a second electrode and is used to supply the integrated circuit with electrical energy. The carrier, the integrated circuit and the energy storage element are monolithically formed, the first electrode being formed from the carrier. |
| 申请公布号 |
US9312250(B2) |
申请公布日期 |
2016.04.12 |
| 申请号 |
US201414468352 |
申请日期 |
2014.08.26 |
| 申请人 |
INFINEON TECHNOLOGIES AUSTRIA AG |
发明人 |
Holweg Gerald;Herndl Thomas;Hofer Guenter;Pachler Walther |
| 分类号 |
H01M10/42;H01L25/16;H01L25/00;H01L23/522;H01L23/58;H01L23/66;H01L23/48 |
主分类号 |
H01M10/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip, comprising:
a carrier; an integrated circuit formed above the carrier; and an energy storage element having a first electrode and a second electrode for supplying the integrated circuit with electrical energy; wherein the carrier, the integrated circuit and the energy storage element are monolithically formed; wherein the carrier is arranged between the second electrode and the integrated circuit; and wherein the first electrode is formed within the carrier. |
| 地址 |
Villach AT |
