发明名称 |
Bump structures having an extension |
摘要 |
A bump structure may include a body portion spaced apart from a pad disposed on a substrate and a first extension extending from a side of the body portion onto the pad. A second extension extends from another side of the body portion. |
申请公布号 |
US9312213(B2) |
申请公布日期 |
2016.04.12 |
申请号 |
US201314014300 |
申请日期 |
2013.08.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Cho Moon Gi;Kim Young Lyong;Park Sun-Hee;Lim Hwan-Sik |
分类号 |
H01L23/48;H01L23/498;H01L23/00 |
主分类号 |
H01L23/48 |
代理机构 |
Renaissance IP Law Group LLP |
代理人 |
Renaissance IP Law Group LLP |
主权项 |
1. A bump structure comprising:
a body portion provided on a substrate and spaced apart from a pad disposed on the substrate; a first extension extending in a first direction from the body portion toward the pad; and a second extension extending in a second direction from the body portion, the second direction opposite to or crossing the first direction, wherein a width of the first extension is smaller than a width of the body portion, wherein the bump structure includes a barrier layer, a metal layer, and a solder layer sequentially stacked on the substrate; and wherein a portion of the solder layer in the body portion is thicker than another portion of the solder layer in the first extension, wherein the first extension covers at least a portion of an upper surface of the pad, and wherein a thickness of the solder layer gradually increases from an end portion of the first extension provided on the pad toward the body portion. |
地址 |
KR |