发明名称 Electronic control apparatus for vehicle using overmolding and manufacturing method thereof
摘要 The present disclosures provides an electronic control apparatus for a vehicle using overmolding in which a heat radiating plate is attached to an opposite side of a part requiring heat radiation in a printed circuit board (PCB) and a part other than the part, to which the heat radiating plate is attached, is overmolded so as to directly discharge heat to the air through the heat radiating plate such that a heat radiation effect is excellent, the heat radiating plate is attached in advance and then a housing is formed of mold resin such that a manufacturing process is simplified, and a printed circuit board (PCB) is surrounded by mold resin such that a waterproof function is excellent, and a manufacturing method thereof.
申请公布号 US9313932(B2) 申请公布日期 2016.04.12
申请号 US201314139842 申请日期 2013.12.23
申请人 HYUNDAI AUTRON CO., LTD. 发明人 Choo Yeon Chul;Yang Sun Jae;Kim Chang Ju;Song Seung Mok;Lee Ju Hyung
分类号 H05K7/20;H05K13/00;G06F1/20;H01L21/44;H05K5/06;H05K5/00 主分类号 H05K7/20
代理机构 Mayer Brown LLP 代理人 Mayer Brown LLP ;Park Hyunho
主权项 1. An electronic control apparatus for a vehicle, comprising: a printed circuit board (PCB) including an electronic control substrate configured to electrically control the electronic control apparatus of the vehicle; at least one heating element positioned on a surface of the electronic control substrate; at least one heat radiating plate having a size corresponding to a size of the at least one heating element positioned on an opposite side of the surface of the electronic control substrate where the at least one heating element is positioned; a connector including a connector pin, and coupled to the PCB; and an overmold housing configured to overmold the at least one heating element, the PCB, and an outer portion of the at least one heat radiating plate with mold resin such that heat generated from the at least one heating element is directly discharged to air through the at least one heat radiating plate positioned on the opposite side of the surface of the electronic control substrate where the at least one heating element is positioned.
地址 Seongnam-Si KR