发明名称 Cooling device for electronic machine
摘要 A cooling device for an electronic machine includes an airflow channel through which external air passes, an air inlet duct through which external air is introduced and which is disposed at an upper front surface of the airflow channel and extends perpendicularly to the airflow channel, a blower fan disposed in the air inlet duct to draw in external air through the air inlet duct, an air outlet duct disposed at a lower portion of the airflow channel to discharge air from the airflow channel, and a heat-radiating unit disposed to the rear of a circuit board mounted with electronic components on a front surface thereof to absorb heat from the circuit board. The heat-radiating unit is located, apart from the blower fan, in the airflow channel. Through the improved cooling airflow structure, cooling efficiency is increased, noise is reduced and continuous cooling operation is achieved.
申请公布号 US9313918(B2) 申请公布日期 2016.04.12
申请号 US201314063578 申请日期 2013.10.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Lee Wook Jin;Kim Sung Tae;Lee Yong Ho;Park Young Chal;Shin Se Hoon
分类号 H05K7/20 主分类号 H05K7/20
代理机构 Staas & Halsey LLP 代理人 Staas & Halsey LLP
主权项 1. A cooling device for an electronic machine comprising: an airflow channel through which external air passes; an air inlet duct through which external air is introduced and configured to guide the introduced external air in a first direction, the air inlet duct being disposed at an upper front portion of the airflow channel and extending perpendicular to the airflow channel; a blower fan disposed in the air inlet duct to draw in external air through the air inlet duct; an air outlet duct disposed at a lower portion of the airflow channel to discharge air having passed through the airflow channel to outside and configured to guide the air in a second direction opposite to the first direction; and a heat-radiating unit disposed to a rear portion of a circuit board mounted with electronic components on a front surface thereof to absorb heat generated from the circuit board, the heat-radiating unit being located, apart from the blower fan, in a passage of the airflow channel.
地址 Suwon-Si KR