Substrate having electronic component embedded therein and method of manufacturing the same

摘要

A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up insulating layers stacked on or beneath the first insulating layer; upper and lower circuit patterns formed on the build-up insulating layers, respectively; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern.

主权项

1. A substrate having an electronic component embedded therein, comprising:
the electronic component including an external electrode; a first insulating layer including a cavity into which at least a portion of the electronic component is inserted and having a first circuit pattern provided on one surface thereof and a second circuit pattern provided on the other surface thereof; a second insulating layer covering the first circuit pattern and one surface of the first insulating layer; a third insulating layer covering the second circuit pattern and the other surface of the first insulating layer; a third circuit pattern provided on a surface of the second insulating layer; a fourth circuit pattern provided on a surface of the third insulating layer; a first via directly connecting the external electrode and the third circuit pattern to each other while penetrating through the second insulating layer; a second via directly connecting the first circuit pattern and the third circuit pattern to each other while penetrating through the second insulating layer; a third via directly connecting the first circuit pattern and the second circuit pattern to each other while penetrating through the first insulating layer; a fourth via directly connecting the second circuit pattern and the fourth circuit pattern to each other while penetrating through the third insulating layer; and a fifth via directly connecting the external electrode and the forth circuit pattern to each other while penetrating through the third insulating layer, wherein an electrical loop is formed by connections from the external electrode to the third circuit pattern through the first via, from the third circuit pattern to the first circuit pattern through the second via, from the first circuit pattern to the second circuit pattern through the third via, from the second circuit pattern to the fourth circuit pattern though the fourth via, and from the fourth circuit pattern to the external electrode through the fifth via.