Method for improving surface quality of spalled substrates

摘要

A compliant material is formed between a base substrate and a support structure prior to performing a controlled spalling process. By positioning the compliant material between the base substrate and the support structure, the localized effects of surface perturbations (particles, wafer artifacts, etc.) on spalling mode fracture can be reduced. The method of the present disclosure thus leads to improved surface quality of the spalled material layer and the remaining base substrate. Moreover, the method of the present disclosure can reduce the density of cleaving artifacts.

主权项

1. A method for removing a material layer from a base substrate, said method comprising:
forming a plating seed layer on a surface of a metal-containing adhesion layer, said metal-containing adhesion layer is located atop a first surface of a base substrate; forming a stressor layer atop an exposed surface of the plating seed layer; depositing a compliant layer directly on a second surface of the base substrate that is opposite to said first surface prior to contacting with an underlying support structure; securing the base substrate to said support structure, wherein said compliant layer is interposed between the second surface of the base substrate and the support structure; and removing a material layer of said base substrate by spalling, wherein said material layer is attached to at least said stressor layer.