| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board capable of suppressing transmission loss when used in a high frequency region, and capable of suppressing thermal deformation or thermal degradation at the time of solder reflow, and to provide a method of manufacturing a printed wiring board.SOLUTION: A printed wiring board includes an insulating base film, a conductive pattern formed on the base film, and a cover coat formed directly on one surface of the conductive pattern at least partially. The product of the square root of relative permittivity of the cover coat at 1 GHz, and the dielectric loss tangent at 1 GHz is less than 0.02, the glass-transition temperature is 150°C or more, and the storage elastic modulus at 320°C is 1×10Pa or more. The relative permittivity of the cover coat at 1 GHz is preferably 1.2-3.7. The dielectric loss tangent of the cover coat at 1 GHz is preferably 0.001-0.010.SELECTED DRAWING: Figure 1 |
