| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting method capable of reducing the facility cost and work cost, in the electronic component mounting on a thin-plate or sheet-like circuit board, and to provide a circuit board.SOLUTION: In an electronic component mounting method for mounting an electronic component 11 on a thin-plate or sheet-like circuit board 1, a conductor pattern 5 for generating an electrostatic attraction force between the conductive plate 7 of a carrier 6 is formed previously on the circuit board 1, along with a circuit pattern 4 having a pad 4a to which the connection terminal 11a of the electronic component 11 is soldered. When the circuit board 1 is held by the carrier 6 in a component mounting step, an electrostatic attraction force is generated between the conductive plate 7 of a carrier 6, by applying a voltage temporarily between the conductor pattern 5 and the conductive plate 7 of a carrier 6 by a charging power supply 9. Holding state of the circuit board 1 is maintained thereafter by the remaining electrostatic attraction force.SELECTED DRAWING: Figure 3 |
