POLYIMIDE FILM ARRANGEMENT AND MANUFACTURING AND ASSEMBLING THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an ultrathin polyimide cover lay film for covering and protecting a metal circuit formed on a print substrate which has thickness of less than 5 μm and is biaxially orientated.SOLUTION: There is provided a polyimide film arrangement (10) having a polyimide layer (2) having opposite first surface and second surface and a substrate (1) containing polyimide peelably adhering to the first surface of the polyimide layer, and the polyimide layer or the substrate layer contains a filler (12) having surface energy of less than about 35 dyne/cm. There is provided the polyimide film arrangement (10) having peel strength between the substrate layer (1) and the polyimide layer (2) of less than 0.15 kgf/cm. There is provided the polyimide film arrangement (10) having the polyimide layer (2) with about 0.1 to 5 μm in thickness.SELECTED DRAWING: Figure 1