发明名称 |
COPPER ALLOY FOR ELECTRONIC AND ELECTRIC DEVICE, COPPER ALLOY THIN SHEET FOR ELECTRONIC AND ELECTRIC DEVICE, COMPONENT AND TERMINAL FOR ELECTRONIC AND ELECTRIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for electronic and electric device excellent surely and sufficiently in flexure processability, stress relaxation resistance and shear processability, and excellent in strength and conductivity.SOLUTION: A copper alloy for electronic and electric device has a composition containing Ni of 1.0 mass% to 5.0 mass%, Si of 0.1 mass% to 1.5 mass% and the balance Cu with inevitable impurities and having Ni/Si (mass ratio) in a range of 2.0 to 6.0, a crystal grain boundary set between measurement points having direction difference between neighboring measurement of over 15° by measuring measurement area of 1000 μmor more by EBSD method with measurement interval of 0.1 μm and analyzing it with excluding the measurement point having CI value analyzed by a data analysis soft OIM of 0.1 or less, special grain boundary ratio (Lσ/L) which is a ratio of the sum of each boundary length of Σ3, Σ9, Σ27a, Σ27b to all crystal grain boundary length of 10% or more and less than 60% and Vickers hardness of a surface of 120 or more.SELECTED DRAWING: None |
申请公布号 |
JP2016050326(A) |
申请公布日期 |
2016.04.11 |
申请号 |
JP20140175147 |
申请日期 |
2014.08.29 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
MAKI KAZUMASA;MATSUNAGA HIROTAKA |
分类号 |
C22C9/06;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/05;C22C9/10;H01B1/02;H01B5/02 |
主分类号 |
C22C9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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