发明名称 INTEGRATED CIRCUIT DEVICE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an integrated circuit device and an electronic apparatus in which the impedance of a drive signal can be equalized, and the chip area can be reduced.SOLUTION: An integrated circuit device includes a first bridge circuit (HB1) arranged in a first region R1 on the first direction D1 side for a reference line L1 in a plan view for the substrate of an integrated circuit device, a second bridge circuit (HB2) arranged in a second region R2 on the second direction D2 side for the reference line L1 in a plan view, a first predriver (PRB1) for driving the first bridge circuit (HB1), a second predriver (PRB2) for driving the second bridge circuit (HB2). The first predriver (PRB1) is arranged in the first region R1, and the second predriver (PRB2)is arranged in the second region.SELECTED DRAWING: Figure 2
申请公布号 JP2016051723(A) 申请公布日期 2016.04.11
申请号 JP20140174234 申请日期 2014.08.28
申请人 SEIKO EPSON CORP 发明人 MORIYA ISAMU
分类号 H01L21/822;H01L21/82;H01L21/8234;H01L21/8238;H01L27/04;H01L27/08;H01L27/088;H01L27/092;H03K17/04;H03K17/687;H03K19/0175 主分类号 H01L21/822
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