发明名称 SOLDERING FLUX AND SOLDER PASTE
摘要 PROBLEM TO BE SOLVED: To provide a soldering flux capable of making a heating droop suppression and a satisfactory sintering washability compatible at a reflow step and having a satisfactory printability and an irregular shape bump depression effect, and a solder paste using the same.SOLUTION: A soldering flux contains a rosin resin, a solvent, an activator, and a thixotropic agent, and is characterized in that the thixotropic agent contains cured castor oil and a dibenzylidene sorbitol compound.SELECTED DRAWING: Figure 1
申请公布号 JP2016049567(A) 申请公布日期 2016.04.11
申请号 JP20150155550 申请日期 2015.08.05
申请人 TAMURA SEISAKUSHO CO LTD 发明人 SHIBASAKI MASANORI;TAKEUCHI TAKEHIRO;FURUKAWA YUTARO
分类号 B23K35/363 主分类号 B23K35/363
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