发明名称 METHOD FOR MANUFACTURING QUARTZ CRYSTAL WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a quartz crystal wafer, capable of reducing chips and cracks, such as a chipping by polishing to improve productivity while easily identifying one direction of crystal axes without providing an orientation flat.SOLUTION: A method for manufacturing a quartz crystal wafer comprises: the quartz plate formation step of cutting a quartz crystal member to form a quartz plate 11; the line depression formation step of forming a line depression 12 on one main surface of the quartz plate 11; the quartz crystal block formation step of bonding the quartz plates 11 to form a quartz crystal block; the shape formation step of cutting the quartz crystal block or polishing the side surfaces of the quartz crystal block to form the shape of the quartz plate 11; the polishing step of polishing both main surfaces of the quartz plate 11; the etching step of etching the quartz plate 11; and the axial direction identification step of identifying an axial direction of the quartz plate 11 from the shape of the depression 12 formed in the quartz plate 11.SELECTED DRAWING: Figure 7
申请公布号 JP2016050150(A) 申请公布日期 2016.04.11
申请号 JP20140176658 申请日期 2014.08.30
申请人 KYOCERA CRYSTAL DEVICE CORP 发明人 IIDA HIROAKI;SASAOKA KOHEI
分类号 C30B29/18;B28D5/00;C30B33/00 主分类号 C30B29/18
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