发明名称 |
METHOD FOR MANUFACTURING QUARTZ CRYSTAL WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a quartz crystal wafer, capable of reducing chips and cracks, such as a chipping by polishing to improve productivity while easily identifying one direction of crystal axes without providing an orientation flat.SOLUTION: A method for manufacturing a quartz crystal wafer comprises: the quartz plate formation step of cutting a quartz crystal member to form a quartz plate 11; the line depression formation step of forming a line depression 12 on one main surface of the quartz plate 11; the quartz crystal block formation step of bonding the quartz plates 11 to form a quartz crystal block; the shape formation step of cutting the quartz crystal block or polishing the side surfaces of the quartz crystal block to form the shape of the quartz plate 11; the polishing step of polishing both main surfaces of the quartz plate 11; the etching step of etching the quartz plate 11; and the axial direction identification step of identifying an axial direction of the quartz plate 11 from the shape of the depression 12 formed in the quartz plate 11.SELECTED DRAWING: Figure 7 |
申请公布号 |
JP2016050150(A) |
申请公布日期 |
2016.04.11 |
申请号 |
JP20140176658 |
申请日期 |
2014.08.30 |
申请人 |
KYOCERA CRYSTAL DEVICE CORP |
发明人 |
IIDA HIROAKI;SASAOKA KOHEI |
分类号 |
C30B29/18;B28D5/00;C30B33/00 |
主分类号 |
C30B29/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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