发明名称 |
LASER PROCESSING METHOD, MANUFACTURING METHOD OF GLASS PROCESSING PART AND LASER PROCESSOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing method which can form a fine and favorable hole, a manufacturing method of a glass processing part, and a laser processor.SOLUTION: A laser processing method has: a process for forming a modified part 50 by radiating an ultrashort pulse laser beam thereto while moving a focus point 56 of the ultrashort pulse laser beam A which progresses to a direction toward the other main surface from one main surface of a glass base board 46 to one main surface side from the other main surface side of the glass base board; and a process for opening a hole by etching the modified part. When setting the energy of the ultrashort pulse laser beam per one-pulse unit area as E, a moving speed of the focus point as v, and a repeating frequency as f, the following relationships are established. 0.05×10[J/m]≤E≤0.5×10[J/m]. 0.22×10[m.s]≤(v/f)≤10×10[m.s]. 0.018×10[J/(m.s)]≤(E.f/v)≤0.81×10[J/(m.s)].SELECTED DRAWING: Figure 3 |
申请公布号 |
JP2016049542(A) |
申请公布日期 |
2016.04.11 |
申请号 |
JP20140175630 |
申请日期 |
2014.08.29 |
申请人 |
AISIN SEIKI CO LTD;TOYOTA CENTRAL R&D LABS INC |
发明人 |
TAKAHASHI HIDETOMO;YONEMURA MASATOSHI;HASEGAWA KAZUO;KATO SATORU;ICHIKAWA TADASHI;MIZUNO SHINTARO |
分类号 |
B23K26/53;B23K26/00;B23K26/382;C03B33/02 |
主分类号 |
B23K26/53 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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