| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an element substrate enabling high-speed drawing with high yield.SOLUTION: A method for manufacturing an element substrate 1 includes: a step of forming first and second resists 15 and 16 on a predetermined surface of a substrate 14 so that a part of the predetermined surface is exposed; a step of etching the substrate 14 by using the first and second resists 15 and 16 as masks, and forming a first recessed portion 17 on the substrate 14; a step of removing the second resist 16, and exposing a portion different from the first recessed portion 17 of the substrate 14; a step of etching the substrate 14 by using the first resist 15 as a mask, deepening the first recessed portion 17, and forming a second recessed portion 18 communicated with the first recessed portion 17 on the substrate 14; and a step of covering the opening of the first and second recessed portions 17 and 18 with a discharge port forming member 11, forming a pressure chamber 3 with the first recessed portion 17 and the discharge port forming member 12, and forming a diaphragm portion 6 with the second recessed portion 18 and the discharge port forming member 12.SELECTED DRAWING: Figure 1 |
