| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device which can efficiently prevent contamination of a release nozzle.SOLUTION: A substrate is pressed to a polishing pad on a polishing table by a polishing head 1 and is polished while relatively moving the polishing table and the polishing head 1. The polishing head 1 which holds the substrate after polishing is moved to a predetermined position above a substrate delivery device 50, and a cleaning fluid is jetted to the substrate held by the polishing head 1 in the predetermined position to clean the substrate. After cleaning the substrate, release shower is jetted from a release nozzle 53 arranged on the substrate delivery device 50 between the polishing head 1 and the substrate to separate the substrate from the polishing head 1. A fluid is discharged from the release nozzle 53 while cleaning the substrate.SELECTED DRAWING: Figure 8 |
