| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device capable of reducing transmission loss between adjoining semiconductor chips, while reducing the mounting area of the semiconductor chip on a wiring board.SOLUTION: A first semiconductor chip 20 has a first face 23. A second electrode 25 is formed in a part close to one end of the first face 23, in the direction of travel of signal. A second semiconductor chip 30 has a second face 33. A third electrode 34 is formed in a part close to one end of the second face 33, in the direction of travel of signal. The second electrode 25 and third electrode 34 are facing each other, and connected electrically while holding a solder joint 26c therebetween. A signal outputted from the second electrode 25 passes through the solder joint 26c before being inputted to the third electrode 34.SELECTED DRAWING: Figure 2 |
