发明名称 Cu-Ga SPUTTERING TARGET, AND PRODUCTION METHOD OF Cu-Ga SPUTTERING TARGET
摘要 PROBLEM TO BE SOLVED: To provide a Cu-Ga sputtering target capable of depositing stably a Cu-Ga film having a uniform composition, and containing a comparatively-much alkali metal compound; and to provide a production method of the Cu-Ga sputtering target.SOLUTION: A Cu-Ga sputtering target has a composition containing, as metal components excluding fluorine, Ga: 5 atom% or more and 60 atom % or less and K: 0.01 atom% or more and 5 atom % or less, and having a residue comprising Cu and inevitable impurities. Further, in an atom mapping image by a wavelength separation type X-ray detector, a region including Cu, Ga, K and F exists.SELECTED DRAWING: Figure 2
申请公布号 JP2016050363(A) 申请公布日期 2016.04.11
申请号 JP20150167676 申请日期 2015.08.27
申请人 MITSUBISHI MATERIALS CORP;SOLAR FRONTIER KK 发明人 UMEMOTO KEITA;CHO SHUHIN;IO KENSUKE
分类号 C23C14/34;B22F1/00;B22F3/10;C22C1/04;C22C9/00;C22C28/00;C22C30/02;H01L21/363 主分类号 C23C14/34
代理机构 代理人
主权项
地址