发明名称 |
COOLING DEVICE AND ELECTRONIC APPARATUS AND ELECTRIC VEHICLE EQUIPPED WITH THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To improve the cooling performance of a cooling device used in an electric vehicle equipped with a power semiconductor or an electronic apparatus such as an electronic computer.SOLUTION: A heat receiving part 6 includes: a non-return valve 14 located at the downstream side of an inlet 15 and configured to be opened by a balance between a head pressure of a refrigerant 18 condensed and retained and pressures in a feedback path 9 and a heat receiving space 12; an introduction pipe 17 located at the downstream side of the non-return valve 14 and configured to allow the condensed refrigerant 18 to flow; and a refrigerant heating part 16 which is located at the downstream side of the inlet 15 and the upstream side of the non-return valve 14 and causes the condensed refrigerant 18 to retain in the upstream side of the non-return valve 14.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016050757(A) |
申请公布日期 |
2016.04.11 |
申请号 |
JP20140238625 |
申请日期 |
2014.11.26 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
SATO IKU;SUZUKI AYAKA |
分类号 |
F28D15/02;B60L3/00;G06F1/20 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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