发明名称 COOLING DEVICE AND ELECTRONIC APPARATUS AND ELECTRIC VEHICLE EQUIPPED WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To improve the cooling performance of a cooling device used in an electric vehicle equipped with a power semiconductor or an electronic apparatus such as an electronic computer.SOLUTION: A heat receiving part 6 includes: a non-return valve 14 located at the downstream side of an inlet 15 and configured to be opened by a balance between a head pressure of a refrigerant 18 condensed and retained and pressures in a feedback path 9 and a heat receiving space 12; an introduction pipe 17 located at the downstream side of the non-return valve 14 and configured to allow the condensed refrigerant 18 to flow; and a refrigerant heating part 16 which is located at the downstream side of the inlet 15 and the upstream side of the non-return valve 14 and causes the condensed refrigerant 18 to retain in the upstream side of the non-return valve 14.SELECTED DRAWING: Figure 2
申请公布号 JP2016050757(A) 申请公布日期 2016.04.11
申请号 JP20140238625 申请日期 2014.11.26
申请人 PANASONIC IP MANAGEMENT CORP 发明人 SATO IKU;SUZUKI AYAKA
分类号 F28D15/02;B60L3/00;G06F1/20 主分类号 F28D15/02
代理机构 代理人
主权项
地址