| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which inhibits scattering of a cleaning fluid to a surrounding area when a lower surface of a wafer is cleaned.SOLUTION: Lower surface cleaning means (38) includes: wafer holding means (36) which suctions and holds an upper surface (11a) of a wafer (11); brushes (88) which extend in a radial direction of the wafer held by the wafer holding means and contact with a lower surface (11b) of the wafer; nozzles (92) which jet a cleaning fluid (B) to the upper side; and a rotary base (90) which rotates the brushes and the nozzles around a rotation axis perpendicular to the radial direction. Each nozzle is located adjacent to the front side (A) of the brush in a rotation direction and jets the cleaning fluid to an area near an upper end of the brush located adjacent to the rear side of the nozzle in the rotation direction.SELECTED DRAWING: Figure 6 |
