发明名称 THREE-DIMENSIONAL LAMINATED WIRING BOARD, ELECTRONIC APPARATUS, INFORMATION PROCESSING SYSTEM, AND INFORMATION COMMUNICATION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a three-dimensional laminated wiring board, an electronic apparatus, an information processing system, and an information communication system that are capable of simply and reliably confirming that the three-dimensional laminated wiring board is adequately manufactured and implemented.SOLUTION: A three-dimensional laminated wiring board includes a board 1, wirings 311-326, and an authentication pattern Q. The wiring 311-326 are provided in the thickness direction of the board 1. The authentication pattern Q is provided on the board 1, and has the quality of material, shape, arrangement, structure or size that can be identified from the wirings 311-326 and the board 1.SELECTED DRAWING: Figure 1
申请公布号 JP2016051843(A) 申请公布日期 2016.04.11
申请号 JP20140176935 申请日期 2014.09.01
申请人 NAPURA:KK 发明人 SEKINE SHIGENOBU;IKEDA HIROAKI
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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