| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of preventing open circuit between conductor layers, by enhancing stability for tensile stress occurring due to the difference of thermal expansion coefficients between an insulating layer and a conductor layer in a via hole.SOLUTION: A multilayer printed wiring board includes a laminate structure having a first insulating layer, and a first conductor layer formed thereon, a second insulating layer formed on the surface of the laminate structure on the side where the first conductor layer is located, a hole penetrating the first conductor layer from the surface of the second insulating layer on the opposite side from the laminate structure side, and reaching the first insulating layer, and a second conductor layer covering the inner surface of the hole and the surface of the second insulating layer on the periphery of the opening of the hole, and connected with the first conductor layer. The diameter of the hole reaching the first insulating layer on the bottom face is larger than that in the first conductor layer at a surface position on the opposite side from the first insulating layer side.SELECTED DRAWING: Figure 1 |
