发明名称 CONTACT/CONTACTLESS COMMON IC CARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a contact/contactless common IC card capable of stabilizing the burial depth of an antenna coil in a card and a method for manufacturing the same.SOLUTION: Contact/contactless common IC cards 10A and 10B include a first card base material 11 having a first main surface 1a and a second main surface 1b facing the first main surface 1a, a second card base material 12 laminated on the first main surface 1a and made of a material whose softening point temperature is lower than that of the first card base material 11, an antenna coil 13 buried in the second card base material 12 along the first main surface 1a, so as to come into contact with the first main surface 1a of the first card base material 11, and an IC module 50 electrically connected to the antenna coil 13.SELECTED DRAWING: Figure 1
申请公布号 JP2016051330(A) 申请公布日期 2016.04.11
申请号 JP20140176307 申请日期 2014.08.29
申请人 TOPPAN TDK LABEL CO LTD 发明人 SHIMADA DAISUKE
分类号 G06K19/077;B42D25/305;B42D25/45;G06K19/07 主分类号 G06K19/077
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