| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing carrier-fitted copper foil good in circuit formability to an extra-thin copper layer.SOLUTION: Provided is a method for producing carrier-fitted copper foil comprising a process where carrier-fitted copper foil provided with a carrier, an intermediate layer, an extra-thin copper layer and a silane coupling treatment layer in this order is subjected to heating treatment at a heating temperature of 100 to 220°C for 1 to 8 hr to form a plated circuit, thereafter, the other carrier-fitted copper foil is laminated on the circuit, the carrier is peeled, conduction is taken with via-fill G, further, a circuit plating is formed H, and subsequently, the first carrier is peeled I.SELECTED DRAWING: Figure 4 |
