发明名称 CONDUCTIVE RESIN COMPOSITION AND RESIN MOLDED BODY
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin composition capable of maintaining mechanic physical properties which a resin component originally has and exhibiting excellent conductivity stably and a resin molded body.SOLUTION: There is provided a conductive resin composition containing an ultra-high-molecular-weight polyethylene resin (A), a high-density polyethylene resin (B) and a conductive product (C) and having viscosity average molecular weight of the (A) component [g/mol] of 1,000,000 to 11,000,000, viscosity average molecular weight of the (B) component [g/mol] of 200,000 or more and less than 1,000,000, the content of the (A) component of over 70 mass% and less than 90 mass% based on sum of the (A) component and the (B) component of 100 mass%, where the (C) component contains metal dope zinc oxide, the (A) component and the (B) component forms a phase separation structure having a continuous phase consisting at least the (B) component and the (C) component exists in the continuous phase consisting of the (B) component. There is also provided a resin molded body obtained by molding the same.SELECTED DRAWING: Figure 1
申请公布号 JP2016050306(A) 申请公布日期 2016.04.11
申请号 JP20150131210 申请日期 2015.06.30
申请人 QUADRANT POLYPENCO JAPAN LTD 发明人 IIDA KAZUNORI;ODAKA YOSHIHIDE;AKIBA YUKIO
分类号 C08L23/06;C08K3/22;C08L91/06;H01B1/20;H01B13/00 主分类号 C08L23/06
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