发明名称 RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which can achieve a high glass transition temperature and the dielectric constant of which can be decreased.SOLUTION: There is provided the resin composition including an epoxy resin and a curing agent including a first acid anhydride and a second acid anhydride. The unsaturated bond concentration, represented by the following formula (1), for the second acid anhydride is 0.7% or less. The ratio of the number of acid anhydride equivalent in the first acid anhydride to the number of epoxy equivalent in the epoxy resin is 0.05 or more and 0.5 or less, and the ratio of the total of the number of acid anhydride equivalent of the first acid anhydride and second acid anhydride to the number of the epoxy equivalent is 0.5 or more and 1.1 or less. Unsaturated bond concentration={(number of unsaturated bond in one molecule/molecular weight)/number of acid anhydride group in one molecule}×100 ---(1).SELECTED DRAWING: Figure 1
申请公布号 JP2016050315(A) 申请公布日期 2016.04.11
申请号 JP20150168206 申请日期 2015.08.27
申请人 PANASONIC IP MANAGEMENT CORP 发明人 ARAI DAISUKE;MOTOBE EIJI;HIGASHIDA TOSHIYUKI
分类号 C08G59/42;B32B15/092;B32B27/20;C08J5/24;C08K3/00;C08L63/00;H05K1/03 主分类号 C08G59/42
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