| 摘要 |
PROBLEM TO BE SOLVED: To reduce a manufacturing cost while improving cooling performance, and improve work efficiency of assembling work.SOLUTION: A power conversion device includes a fin unit 30 for radiating heat of a first semiconductor element 11 mounted to a first substrate 10, and a support 40 forming a device body for housing the first semiconductor element 11, and allowing thermal connection of the fin unit 30 to the first semiconductor element 11. The support 40 includes a frame part 41 formed so as to surround a substrate arrangement region S while having a fixing guide member 47 for guiding the first substrate 10 to the substrate arrangement region S when the first substrate 10 is relatively in close proximity thereto, and a beam part 42 for connecting portions mutually facing each other in the frame part 41, or portions adjacent to each other.SELECTED DRAWING: Figure 2 |
